Program: DIBC

Solicitation Number: RWP-MIC-24-01 Microelectronics

Customer: MCEIP

Release Date: 03/27/2024

Submission Deadline: 04/26/2024 5PM ET

Description: The DoD’s Advanced PCBs and Electronic Substrates initiative is to invest in prototype projects across key strategic areas to bolster high-mix, low-volume domestic capabilities. Proposed solutions must be at least a technology readiness level (TRL) 6 and/or a manufacturing readiness level (MRL) of 5. Enhanced White Papers should align within one or more of the following technical requirement areas:

  • MIC-24-001: domestic complex printed circuit board (High Density Interconnect [HDI] and/or organic Integrated Circuit (IC) substrate) construction and production capability and capacity;
  • MIC-24-002: domestic sourcing for enabling manufacturing materials;
  • MIC-24-003: improved microvia reliability; and
  • MIC-24-004: high-density interconnect reliability data.

active_solicitations

solicitation_program: DIBC

solicitation_number: RWP-MIC-24-01 Microelectronics

solicitation_customer: MCEIP

solicitation_release_date: 03/27/2024

solicitation_submission_deadline: 04/26/2024 5PM ET

solicitation_description: The DoD’s Advanced PCBs and Electronic Substrates initiative is to invest in prototype projects across key strategic areas to bolster high-mix, low-volume domestic capabilities. Proposed solutions must be at least a technology readiness level (TRL) 6 and/or a manufacturing readiness level (MRL) of 5. Enhanced White Papers should align within one or more technical requirement areas.

solicitation_url: https://www.dibconsortium.org/solicitations/

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